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1

A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer

A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer

by BAOCHANG XU, YU ZHANG, VOON YEW THEAN, YEOW KHENG LIM
Published 2022

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2

Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™

Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™

by Baochang Xu, Yu Zhang, Chun Fei Siah, Voon Yew Thean, Yeow Kheng Lim
Published 2023

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