Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™

• المؤلفون الرئيسيون: Baochang Xu, Yu Zhang, Chun Fei Siah, Voon Yew Thean, Yeow Kheng Lim
• مؤلفون آخرون: ELECTRICAL AND COMPUTER ENGINEERING
• التنسيق: Conference or Workshop Item
• اللغة: English
• منشور في: Optica Publishing Group 2023
• الموضوعات: Silicon photonics; Advanced packaging
• الوصول للمادة أونلاين: https://scholarbank.nus.edu.sg/handle/10635/238261

2022 European Conference on Optical Communication (ECOC), Basel, Switzerland, 2022