Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™

Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™

2022 European Conference on Optical Communication (ECOC), Basel, Switzerland, 2022

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Bibliographic Details
Main Authors: Baochang Xu, Yu Zhang, Chun Fei Siah, Voon Yew Thean, Yeow Kheng Lim
Other Authors: ELECTRICAL AND COMPUTER ENGINEERING
Format: Conference or Workshop Item
Language:English
Published: Optica Publishing Group 2023
Subjects:
Silicon photonics
Advanced packaging
Online Access:https://scholarbank.nus.edu.sg/handle/10635/238261
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Institution: National University of Singapore
Language: English

Internet

https://scholarbank.nus.edu.sg/handle/10635/238261

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