A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer

A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer

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Bibliographic Details
Main Authors: BAOCHANG XU, YU ZHANG, VOON YEW THEAN, YEOW KHENG LIM
Other Authors: DEAN'S OFFICE (COLLEGE OF DESIGN & ENG)
Format: Conference or Workshop Item
Published: VLSI Symposium 2022
Online Access:https://scholarbank.nus.edu.sg/handle/10635/218956
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Institution: National University of Singapore

Internet

https://scholarbank.nus.edu.sg/handle/10635/218956

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