A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer

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Bibliographic Details
Main Authors:	BAOCHANG XU, YU ZHANG, VOON YEW THEAN, YEOW KHENG LIM
Other Authors:	DEAN'S OFFICE (COLLEGE OF DESIGN & ENG)
Format:	Conference or Workshop Item
Published:	VLSI Symposium 2022
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/218956
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-218956
record_format	dspace
spelling	sg-nus-scholar.10635-2189562024-11-12T00:57:07Z A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer BAOCHANG XU YU ZHANG VOON YEW THEAN YEOW KHENG LIM DEAN'S OFFICE (COLLEGE OF DESIGN & ENG) 2022-04-12T07:07:07Z 2022-04-12T07:07:07Z 2022-04-01 Conference Paper BAOCHANG XU, YU ZHANG, VOON YEW THEAN, YEOW KHENG LIM (2022-04-01). A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/218956 CC0 1.0 Universal http://creativecommons.org/publicdomain/zero/1.0/ VLSI Symposium
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
author2	DEAN'S OFFICE (COLLEGE OF DESIGN & ENG)
author_facet	DEAN'S OFFICE (COLLEGE OF DESIGN & ENG) BAOCHANG XU YU ZHANG VOON YEW THEAN YEOW KHENG LIM
format	Conference or Workshop Item
author	BAOCHANG XU YU ZHANG VOON YEW THEAN YEOW KHENG LIM
spellingShingle	BAOCHANG XU YU ZHANG VOON YEW THEAN YEOW KHENG LIM A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer
author_sort	BAOCHANG XU
title	A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer
title_short	A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer
title_full	A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer
title_fullStr	A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer
title_full_unstemmed	A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer
title_sort	wafer scale hybrid integration platform for co-packaged photonics using a cmos based optical interposer
publisher	VLSI Symposium
publishDate	2022
url	https://scholarbank.nus.edu.sg/handle/10635/218956
_version_	1821221564701474816

A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer

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