A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer
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| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
VLSI Symposium
2022
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| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/218956 |
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| Institution: | National University of Singapore |