Wafer-level isothermal electromigration study on deep sub-micron interconnect metallization

• Main Author: Lim, Yeow Kheng.
• Other Authors: Goh, Wang Ling
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• Online Access: http://hdl.handle.net/10356/4698
• Institution: Nanyang Technological University

The main focus is to further develop the accelerated wafer-level ISO-J and IOS-T EM tests with the possibility of incorporation into wafer fabrication for rapid EM evaluation of new interconnect metallization.