Wafer-level isothermal electromigration study on deep sub-micron interconnect metallization

The main focus is to further develop the accelerated wafer-level ISO-J and IOS-T EM tests with the possibility of incorporation into wafer fabrication for rapid EM evaluation of new interconnect metallization.

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Bibliographic Details
Main Author:	Lim, Yeow Kheng.
Other Authors:	Goh, Wang Ling
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Online Access:	http://hdl.handle.net/10356/4698
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-4698
record_format	dspace
spelling	sg-ntu-dr.10356-46982023-07-04T15:29:21Z Wafer-level isothermal electromigration study on deep sub-micron interconnect metallization Lim, Yeow Kheng. Goh, Wang Ling School of Electrical and Electronic Engineering Tse, Man Siu DRNTU::Engineering::Electrical and electronic engineering::Microelectronics The main focus is to further develop the accelerated wafer-level ISO-J and IOS-T EM tests with the possibility of incorporation into wafer fabrication for rapid EM evaluation of new interconnect metallization. Master of Engineering 2008-09-17T09:56:52Z 2008-09-17T09:56:52Z 2002 2002 Thesis http://hdl.handle.net/10356/4698 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Lim, Yeow Kheng. Wafer-level isothermal electromigration study on deep sub-micron interconnect metallization
description	The main focus is to further develop the accelerated wafer-level ISO-J and IOS-T EM tests with the possibility of incorporation into wafer fabrication for rapid EM evaluation of new interconnect metallization.
author2	Goh, Wang Ling
author_facet	Goh, Wang Ling Lim, Yeow Kheng.
format	Theses and Dissertations
author	Lim, Yeow Kheng.
author_sort	Lim, Yeow Kheng.
title	Wafer-level isothermal electromigration study on deep sub-micron interconnect metallization
title_short	Wafer-level isothermal electromigration study on deep sub-micron interconnect metallization
title_full	Wafer-level isothermal electromigration study on deep sub-micron interconnect metallization
title_fullStr	Wafer-level isothermal electromigration study on deep sub-micron interconnect metallization
title_full_unstemmed	Wafer-level isothermal electromigration study on deep sub-micron interconnect metallization
title_sort	wafer-level isothermal electromigration study on deep sub-micron interconnect metallization
publishDate	2008
url	http://hdl.handle.net/10356/4698
_version_	1772827813594791936

Wafer-level isothermal electromigration study on deep sub-micron interconnect metallization

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