Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

IEEE Transactions on Advanced Packaging

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Bibliographic Details
Main Authors: Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60883
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/60883

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