Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package
IEEE Transactions on Advanced Packaging
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2014
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sg-nus-scholar.10635-608832023-08-18T08:57:24Z Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package Tay, A.A.O. Iyer, M.K. Tummala, R.R. Kripesh, V. Wong, E.H. Swaminathan, M. Wong, C.P. Rotaru, M.D. Doraiswami, R. Ang, S.S. Kang, E.T. CHEMICAL & BIOMOLECULAR ENGINEERING MECHANICAL ENGINEERING IEEE Transactions on Advanced Packaging 27 2 413-425 ITAPF 2014-06-17T06:28:27Z 2014-06-17T06:28:27Z 2004-05 Article Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T. (2004-05). Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package. IEEE Transactions on Advanced Packaging 27 (2) : 413-425. ScholarBank@NUS Repository. 15213323 http://scholarbank.nus.edu.sg/handle/10635/60883 000223599100018 Scopus |
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Singapore Singapore |
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IEEE Transactions on Advanced Packaging |
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CHEMICAL & BIOMOLECULAR ENGINEERING |
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CHEMICAL & BIOMOLECULAR ENGINEERING Tay, A.A.O. Iyer, M.K. Tummala, R.R. Kripesh, V. Wong, E.H. Swaminathan, M. Wong, C.P. Rotaru, M.D. Doraiswami, R. Ang, S.S. Kang, E.T. |
| format |
Article |
| author |
Tay, A.A.O. Iyer, M.K. Tummala, R.R. Kripesh, V. Wong, E.H. Swaminathan, M. Wong, C.P. Rotaru, M.D. Doraiswami, R. Ang, S.S. Kang, E.T. |
| spellingShingle |
Tay, A.A.O. Iyer, M.K. Tummala, R.R. Kripesh, V. Wong, E.H. Swaminathan, M. Wong, C.P. Rotaru, M.D. Doraiswami, R. Ang, S.S. Kang, E.T. Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package |
| author_sort |
Tay, A.A.O. |
| title |
Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package |
| title_short |
Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package |
| title_full |
Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package |
| title_fullStr |
Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package |
| title_full_unstemmed |
Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package |
| title_sort |
next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/60883 |
| _version_ |
1775627839366758400 |