Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™

2022 European Conference on Optical Communication (ECOC), Basel, Switzerland, 2022

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Bibliographic Details
Main Authors:	Baochang Xu, Yu Zhang, Chun Fei Siah, Voon Yew Thean, Yeow Kheng Lim
Other Authors:	ELECTRICAL AND COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Language:	English
Published:	Optica Publishing Group 2023
Subjects:	Silicon photonics Advanced packaging
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/238261
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-238261
record_format	dspace
spelling	sg-nus-scholar.10635-2382612024-04-16T11:13:44Z Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™ Baochang Xu Yu Zhang Chun Fei Siah Voon Yew Thean Yeow Kheng Lim ELECTRICAL AND COMPUTER ENGINEERING Silicon photonics Advanced packaging 2022 European Conference on Optical Communication (ECOC), Basel, Switzerland, 2022 1-4 2023-03-20T03:57:10Z 2023-03-20T03:57:10Z 2022-09-18 Conference Paper Baochang Xu, Yu Zhang, Chun Fei Siah, Voon Yew Thean, Yeow Kheng Lim (2022-09-18). Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™. 2022 European Conference on Optical Communication (ECOC), Basel, Switzerland, 2022 : 1-4. ScholarBank@NUS Repository. 978-1-957171-15-9 https://scholarbank.nus.edu.sg/handle/10635/238261 en Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/ Optica Publishing Group
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
language	English
topic	Silicon photonics Advanced packaging
spellingShingle	Silicon photonics Advanced packaging Baochang Xu Yu Zhang Chun Fei Siah Voon Yew Thean Yeow Kheng Lim Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™
description	2022 European Conference on Optical Communication (ECOC), Basel, Switzerland, 2022
author2	ELECTRICAL AND COMPUTER ENGINEERING
author_facet	ELECTRICAL AND COMPUTER ENGINEERING Baochang Xu Yu Zhang Chun Fei Siah Voon Yew Thean Yeow Kheng Lim
format	Conference or Workshop Item
author	Baochang Xu Yu Zhang Chun Fei Siah Voon Yew Thean Yeow Kheng Lim
author_sort	Baochang Xu
title	Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™
title_short	Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™
title_full	Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™
title_fullStr	Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™
title_full_unstemmed	Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™
title_sort	passively aligned flip-chip laser diodes using multi-axial slide-stop guided design and laser assisted bonding (lab) on a cmos-based optical interposer™
publisher	Optica Publishing Group
publishDate	2023
url	https://scholarbank.nus.edu.sg/handle/10635/238261
_version_	1800915798863118336

Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™

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