Bonding for 3D ICs and heterogeneous system

by Chia, Hong Ling.
Published 2009

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

by Yan, Li Ling, Gan, Chee Lip, Kor, Katherine Hwee Boon, Chia, Hong Ling, Pey, Kin Leong, Made, Riko I., Thompson, Carl V.
Published 2013

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

by Made, Riko I., Thompson, Carl V., Gan, Chee Lip, Yan, Li Ling, Kor, Katherine Hwee Boon, Chia, Hong Ling, Pey, Kin Leong
Published 2012