Bonding for 3D ICs and heterogeneous system

• Main Author: Chia, Hong Ling.
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Materials; DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: http://hdl.handle.net/10356/15350
• Institution: Nanyang Technological University

In the current two-dimensional (2D) integrated circuits, the chip size is increasing despite the reduction in feature size. This leads to increased complexity of chip design as more and more transistors are closely packed. Hence, three-dimensional technology is the solution. In general, 3D technolog...