Containment of AIDS in Singapore--legal and policy implications.

by Iyer, T.K.
Published 2013

Kidneys for transplant - 'opting out' law in Singapore

by Iyer, T.K.K.
Published 2013

The function of legislation in transplant programs

by Iyer, T.K.K.
Published 2013

Fundamental frequency model of a dynamic voltage restorer

by Iyer R.K., Ramasamy A.K., Ramachandaramuthy V.K., Murkerjee R.N.
Published 2023

Dynamic voltage restorer for voltage sag compensation

by Ramasamy A.K., Iyer R.K., Ramachandaramuthy V.K., Mukerjee R.N.
Published 2023

Effects of acupuncture and biofeedback on EMG and symptom severity in chronic pain patients

by Grewal, J.K., Iyer, N.K.N., Sim, M.K.
Published 2012

Circuit model of elastomer probe for fine pitch wafer level package test applications

by Jayabalan, J., Ooi, B.L., Leong, M.S., Iyer, M.K.
Published 2014

Design and development of interconnects for ultra-fine pitch wafer level packages

by Tay, A.A.O., Iyer, M.K., Tummala, R.R.
Published 2014

Novel circuit model for three-dimensional geometries with multilayer dielectrics

by Jayabalan, J., Ooi, B.-L., Leong, M.-S., Iyer, M.K.
Published 2014

Modelling and application of elastomer mesh for microwave probing

by Jayabalan, J., Ooi, B.-L., Leong, M.S., Iyer, M.K.
Published 2014

Novel method for Simultaneous Switching Noise analysis in electronic packages

by Jin, Zhang, Iyer, Mahadevan K., Ooi, Ban Leong, Leong, Mook Seng
Published 2014

Novel method for Simultaneous Switching Noise analysis in electronic packages

by Jin, Zhang, Iyer, Mahadevan K., Ooi, Ban Leong, Leong, Mook Seng
Published 2014

A scaling technique for partial element equivalent circuit analysis using SPICE

by Jayabalan, J., Leong, O.B., Seng, L.M., Iyer, M.K.
Published 2014

Via design optimization for high speed device packaging

by Low, Hong-Guan, Iyer, Mahadevan K., Ooi, Ban-Leong, Leong, Mook-Seng
Published 2014

Via design optimization for high speed device packaging

by Low, Hong-Guan, Iyer, Mahadevan K., Ooi, Ban-Leong, Leong, Mook-Seng
Published 2014

Novel electrical performance analysis for leaded packages

by Jin, Z., Ma, J., Iyer, M.K., Ooi, B.L., Leong, M.S.
Published 2014

PEEC model for multiconductor systems including dielectric mesh

by Jayabalan, J., Ooi, B.L., Irene, A., Leong, M.S., Iyer, M.K.
Published 2014

Novel electrical performance analysis for leaded packages

by Jin, Z., Ma, J., Iyer, M.K., Ooi, B.L., Leong, M.S.
Published 2014

A review of metasurface-assisted RCS reduction techniques

by Murugesan, Akila, Selvan, Krishnasamy T., Iyer, Ashwin K., Srivatsav, Kumar V., Alphones, Arokiaswami
Published 2022

A methodology for accurate modeling of a pad structure from S-parameter measurements

by Jayabalan, J., Ooi, B.L., Wu, B., Xu, D.S., Iyer, M.K., Leong, M.S.
Published 2014