Interdependent intermetallic compound growth in an electroless Ni-P/Sn-3.5Ag reaction couple

بواسطة Kumar, Aditya, Chen, Zhong
منشور في 2013

Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni–P/Sn–3.5Ag solder joint

بواسطة Kumar, Aditya, Chen, Zhong
منشور في 2013

Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows

بواسطة Mona, M., Chen, Zhong, Kumar, Aditya
منشور في 2013

Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder

بواسطة Kumar, Aditya, He, Min, Chen, Zhong
منشور في 2013

Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizations

بواسطة Kumar, Aditya, Yang, Ying, Wong, Chee C., Kripesh, Vaidhyanathan, Chen, Zhong
منشور في 2013

Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

بواسطة Kumar, Aditya, Chen, Zhong, Mhaisalkar, Subodh Gautam, Wong, Chee Cheong, Teo, Poi Siong, Kripesh, Vaidhyanathan
منشور في 2013