Interdependent intermetallic compound growth in an electroless Ni-P/Sn-3.5Ag reaction couple

由 Kumar, Aditya, Chen, Zhong
出版 2013

Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni–P/Sn–3.5Ag solder joint

由 Kumar, Aditya, Chen, Zhong
出版 2013

Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows

由 Mona, M., Chen, Zhong, Kumar, Aditya
出版 2013

Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder

由 Kumar, Aditya, He, Min, Chen, Zhong
出版 2013

Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizations

由 Kumar, Aditya, Yang, Ying, Wong, Chee C., Kripesh, Vaidhyanathan, Chen, Zhong
出版 2013

Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

由 Kumar, Aditya, Chen, Zhong, Mhaisalkar, Subodh Gautam, Wong, Chee Cheong, Teo, Poi Siong, Kripesh, Vaidhyanathan
出版 2013