Measurement and error analysis of Cu film thickness with Ta barrier layer on wafer for CMP application

由 Qu, Zilian, Wang, Wensong, Li, Xueli, Li, Qi, Zheng, Yuanjin
出版 2022

High-precision resistivity measurement of silicon wafer under unstable lift-off distance using inductive and laser sensors-integrated probe

由 Qu, Zilian, Wang, Wensong, Yang, Zhengchun, Bao, Qiwen, Li, Xueli
出版 2024