High-precision resistivity measurement of silicon wafer under unstable lift-off distance using inductive and laser sensors-integrated probe

• Main Authors: Qu, Zilian, Wang, Wensong, Yang, Zhengchun, Bao, Qiwen, Li, Xueli
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2024
• Subjects: Engineering; Contactless Measurement Probe; Integrated Probe
• Online Access: https://hdl.handle.net/10356/173477
• Institution: Nanyang Technological University

This article proposes a novel contactless method to measure the resistivity of silicon (Si) wafer. In this method, the probe is designed and integrated with an inductive sensor and a laser sensor. The inductive sensor measures the resistivity of Si wafer, and at the same time, the laser sensor detec...