Evidence of ultra-low-k dielectric material degradation and nanostructure alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure

by Lam, Jeffrey C. K., Huang, Maggie Y. M., Ng, Tsu Hau, Mohammed Khalid Dawood, Zhang, Fan, Du, Anyan, Sun, Handong, Shen, Zexiang, Mai, Zhihong
Published 2013