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Shualdi W.
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Shualdi W.
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Shualdi W.
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Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging
by
Shualdi
,
W
.
,
Ahmad, I.
,
Omar, G.
,
Isnin, A.
Published 2017
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Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging
by
Shualdi
W
.
,
Ahmad I.
,
Omar G.
,
Isnin A.
Published 2023
Conference paper
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3
Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging
by
Shualdi
,
W
.
,
Bais, B.
,
Ahmad, I.
,
Omar, G.
,
Isnin, A.
Published 2017
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4
Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging
by
Shualdi
W
.
,
Bais B.
,
Ahmad I.
,
Omar G.
,
Isnin A.
Published 2023
Conference paper
Save to List
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