Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)

by Kornain, Z., Ahmad, I., Omar, G.
Published 2017

Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

by Shualdi, W., Ahmad, I., Omar, G., Isnin, A.
Published 2017

Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

by Shualdi W., Ahmad I., Omar G., Isnin A.
Published 2023

Effect of wafer thinning methods towards fracture strength and topography of silicon die

by Jiun, H.H., Ahmad, I., Jalar, A., Omar, G.
Published 2017

Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping

by Jiun, H.H., Ahmad, I., Jalar, A., Omar, G.
Published 2017

Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump

by Salleh, M.M., Ahmad, I., Jalar, A., Omar, G.
Published 2017

Alternative double pass dicing method for thin wafer laminated with die attach film

by Jiun, H.H., Ahmad, I., Jalar, A., Omar, G.
Published 2017

Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

by Shualdi, W., Bais, B., Ahmad, I., Omar, G., Isnin, A.
Published 2017

The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) deposition

by Md Arshad, M.K., Jalar, A., Ahmad, I., Omar, G.
Published 2017

The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition

by Arshad, M.K.M., Ahmad, I., Jalar, A., Omar, G.
Published 2017

The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition

by Md Arshad, M.K., Ahmad, I., Jalar, A., Omar, G.
Published 2017

Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

by Shualdi W., Bais B., Ahmad I., Omar G., Isnin A.
Published 2023

The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold deposition

by Md Arshad, M.K., Ahmad, I., Jalar, A., Omar, G., Hashim, U.
Published 2017

Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top

by Salleh, M.M., Ahmad, I., Jalar, A., Omar, G., Abdullah, S.H., Arshad, M.K.
Published 2017

High-frequency dielectric analysis of carbon nanofibers from pan precursor at different pyrolysis temperatures

by Munajat, N. A., Nurfaizey, A. H., Bahar, A. A. M., You, K. Y., Fadzullah, S. H. S. M., Omar, G.
Published 2018