Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects

by Made, Riko I., Thompson, Carl V., Leong, H. L., Li, H. Y., Gan, Chee Lip, Pey, Kin Leong
Published 2012

Nanostructured thin film silicon anodes for Li-ion microbatteries

by Omampuliyur Rajamouly S., Bhuiyan Maruf, Zheng Han, Zhu Jing, Lu Li, Fittzgerald Eugene A., Thompson Carl V., Choi Wee Kiong
Published 2016

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

by Yan, Li Ling, Gan, Chee Lip, Kor, Katherine Hwee Boon, Chia, Hong Ling, Pey, Kin Leong, Made, Riko I., Thompson, Carl V.
Published 2013

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

by Made, Riko I., Thompson, Carl V., Gan, Chee Lip, Yan, Li Ling, Kor, Katherine Hwee Boon, Chia, Hong Ling, Pey, Kin Leong
Published 2012