Electron beam induced temperature oscillation for qualitative thermal conductivity analysis by an SThM / ESEM-hybrid-system

by Tiedemann, A.-K., Heiderhoff, R., Balk, L.J., Phang, J.C.H.
Published 2014

Advanced dynamic failure analysis on interconnects by vectorized scanning joule expansion Microscopy

by Tiedemann, A.-K., Fakhri, M., Heiderhoff, R., Phang, J.C.H., Balk, L.J.
Published 2014

Dedicated near-field microscopies for electronic materials and devices

by Balk, L.J., Cramer, R.M., Heiderhoff, R., Phang, J.Ch., Sergeev, O., Tiedemann, A.-K.
Published 2014

Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations

by Tiedemann, A.-K., Kurz, K., Fakhri, M., Heiderhoff, R., Phang, J.C.H., Balk, L.J.
Published 2014