TEKNIK WAFER BONDING DAN ETSA SELEKTIF DALAM FABRIKASI WAFER SOI
Wafer bonding process have been done to support SOI wafer fabrication especially in ELTRAN and SMARTCUT methods. The good quality of wafer bonding was yield by using electrostatic forces (stress >2x 105 N/m2) with carbon electrodes that uses electrical potential around 24 V at 1150°C. On the oth...
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| Format: | Theses |
| Language: | Indonesia |
| Online Access: | https://digilib.itb.ac.id/gdl/view/1693 |
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| Institution: | Institut Teknologi Bandung |
| Language: | Indonesia |