DIELECTRIC BREAKDOWN CHARACTERISTICS FOR EPOXY MOLDING COMPOUND IN WIDE BAND GAP SEMICONDUCTOR USED IN ELECTRIC VEHICLE HIGH- VOLTAGE IC’S AT DRY AND WET CONDITIONS: THEORY AND EXPERIMENT

DIELECTRIC BREAKDOWN CHARACTERISTICS FOR EPOXY MOLDING COMPOUND IN WIDE BAND GAP SEMICONDUCTOR USED IN ELECTRIC VEHICLE HIGH- VOLTAGE IC’S AT DRY AND WET CONDITIONS: THEORY AND EXPERIMENT

Wide band gap semiconductor materials such as Silicon Carbide have demonstrated high efficiency compared to Silicon. However, this material encapsulation technology is still lagging when compared with the performance of SiC. One material that is expected to overcome this issue is epoxy molding c...

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Bibliographic Details
Main Author: Lewi, Irvan
Format: Theses
Language:Indonesia
Online Access:https://digilib.itb.ac.id/gdl/view/81719
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Institution: Institut Teknologi Bandung
Language: Indonesia

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https://digilib.itb.ac.id/gdl/view/81719

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