DIELECTRIC BREAKDOWN CHARACTERISTICS FOR EPOXY MOLDING COMPOUND IN WIDE BAND GAP SEMICONDUCTOR USED IN ELECTRIC VEHICLE HIGH- VOLTAGE ICâS AT DRY AND WET CONDITIONS: THEORY AND EXPERIMENT
Wide band gap semiconductor materials such as Silicon Carbide have demonstrated high efficiency compared to Silicon. However, this material encapsulation technology is still lagging when compared with the performance of SiC. One material that is expected to overcome this issue is epoxy molding c...
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id-itb.:817192024-07-03T10:40:06ZDIELECTRIC BREAKDOWN CHARACTERISTICS FOR EPOXY MOLDING COMPOUND IN WIDE BAND GAP SEMICONDUCTOR USED IN ELECTRIC VEHICLE HIGH- VOLTAGE ICâS AT DRY AND WET CONDITIONS: THEORY AND EXPERIMENT Lewi, Irvan Indonesia Theses Molding Compound, polarization, dielectric, temperature, frequency INSTITUT TEKNOLOGI BANDUNG https://digilib.itb.ac.id/gdl/view/81719 Wide band gap semiconductor materials such as Silicon Carbide have demonstrated high efficiency compared to Silicon. However, this material encapsulation technology is still lagging when compared with the performance of SiC. One material that is expected to overcome this issue is epoxy molding compound. Epoxy Moulding Compound (EMC) is a material that is widely used in electronics. The characterization of the EMC is instrumental in providing information regarding the reliability of power electronic devices. This work aims to comprehend humidity's role in EMC's dielectric breakdown. Several studies have been conducted regarding filler's effect on EMC's dielectric characteristics at low voltages. However, the test will focus on high electric fields and their relationship to conductivity, permittivity, and dielectric loss. Dielectric spectroscopy is utilized here to determine the dielectric properties of a commercial-grade EMC and its linkage to frequency, temperature, and humidity. The test is done on the interdigitated capacitor with five different temperature points, from -25oC, 25oC, 80oC, 100oC, and 130oC, with increasing electrical fields, from 13 kV/mm to 78 kV/mm and 84 kV/mm with the largest value not too far away from the breakdown strength measured during slow ramp breakdown measurements and a frequency range from 0.1 Hz to 10 kHz. This test obtained some exciting results, which can be the basis for further research regarding the EMC. A first observation is that a high electric field affects the relaxation of the material, with relaxation peaks becoming evident only at very high fields. Considering the complex AC conductivity, deviations Jonscher Power Law were observed at high fields and frequencies of around 100 Hz. These deviations seem associated with the onset of secondary peaks at the highest fields. Eventually, a decline of the real permittivity was observed at the highest fields when the frequencies became lower than 1 Hz. This decline is probably associated with the onset of homo-charge in the dielectric. text |
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Wide band gap semiconductor materials such as Silicon Carbide have
demonstrated high efficiency compared to Silicon. However, this material
encapsulation technology is still lagging when compared with the performance of
SiC. One material that is expected to overcome this issue is epoxy molding
compound. Epoxy Moulding Compound (EMC) is a material that is widely used in
electronics. The characterization of the EMC is instrumental in providing
information regarding the reliability of power electronic devices. This work aims
to comprehend humidity's role in EMC's dielectric breakdown. Several studies
have been conducted regarding filler's effect on EMC's dielectric characteristics at
low voltages. However, the test will focus on high electric fields and their
relationship to conductivity, permittivity, and dielectric loss. Dielectric
spectroscopy is utilized here to determine the dielectric properties of a
commercial-grade EMC and its linkage to frequency, temperature, and humidity.
The test is done on the interdigitated capacitor with five different temperature
points, from -25oC, 25oC, 80oC, 100oC, and 130oC, with increasing electrical
fields, from 13 kV/mm to 78 kV/mm and 84 kV/mm with the largest value not too
far away from the breakdown strength measured during slow ramp breakdown
measurements and a frequency range from 0.1 Hz to 10 kHz.
This test obtained some exciting results, which can be the basis for further
research regarding the EMC. A first observation is that a high electric field affects
the relaxation of the material, with relaxation peaks becoming evident only at very
high fields. Considering the complex AC conductivity, deviations Jonscher Power
Law were observed at high fields and frequencies of around 100 Hz. These
deviations seem associated with the onset of secondary peaks at the highest fields.
Eventually, a decline of the real permittivity was observed at the highest fields
when the frequencies became lower than 1 Hz. This decline is probably associated
with the onset of homo-charge in the dielectric. |
format |
Theses |
author |
Lewi, Irvan |
spellingShingle |
Lewi, Irvan DIELECTRIC BREAKDOWN CHARACTERISTICS FOR EPOXY MOLDING COMPOUND IN WIDE BAND GAP SEMICONDUCTOR USED IN ELECTRIC VEHICLE HIGH- VOLTAGE ICâS AT DRY AND WET CONDITIONS: THEORY AND EXPERIMENT |
author_facet |
Lewi, Irvan |
author_sort |
Lewi, Irvan |
title |
DIELECTRIC BREAKDOWN CHARACTERISTICS FOR EPOXY MOLDING COMPOUND IN WIDE BAND GAP SEMICONDUCTOR USED IN ELECTRIC VEHICLE HIGH- VOLTAGE ICâS AT DRY AND WET CONDITIONS: THEORY AND EXPERIMENT |
title_short |
DIELECTRIC BREAKDOWN CHARACTERISTICS FOR EPOXY MOLDING COMPOUND IN WIDE BAND GAP SEMICONDUCTOR USED IN ELECTRIC VEHICLE HIGH- VOLTAGE ICâS AT DRY AND WET CONDITIONS: THEORY AND EXPERIMENT |
title_full |
DIELECTRIC BREAKDOWN CHARACTERISTICS FOR EPOXY MOLDING COMPOUND IN WIDE BAND GAP SEMICONDUCTOR USED IN ELECTRIC VEHICLE HIGH- VOLTAGE ICâS AT DRY AND WET CONDITIONS: THEORY AND EXPERIMENT |
title_fullStr |
DIELECTRIC BREAKDOWN CHARACTERISTICS FOR EPOXY MOLDING COMPOUND IN WIDE BAND GAP SEMICONDUCTOR USED IN ELECTRIC VEHICLE HIGH- VOLTAGE ICâS AT DRY AND WET CONDITIONS: THEORY AND EXPERIMENT |
title_full_unstemmed |
DIELECTRIC BREAKDOWN CHARACTERISTICS FOR EPOXY MOLDING COMPOUND IN WIDE BAND GAP SEMICONDUCTOR USED IN ELECTRIC VEHICLE HIGH- VOLTAGE ICâS AT DRY AND WET CONDITIONS: THEORY AND EXPERIMENT |
title_sort |
dielectric breakdown characteristics for epoxy molding compound in wide band gap semiconductor used in electric vehicle high- voltage icâs at dry and wet conditions: theory and experiment |
url |
https://digilib.itb.ac.id/gdl/view/81719 |
_version_ |
1822997414325256192 |