DIELECTRIC BREAKDOWN CHARACTERISTICS FOR EPOXY MOLDING COMPOUND IN WIDE BAND GAP SEMICONDUCTOR USED IN ELECTRIC VEHICLE HIGH- VOLTAGE ICâS AT DRY AND WET CONDITIONS: THEORY AND EXPERIMENT
Wide band gap semiconductor materials such as Silicon Carbide have demonstrated high efficiency compared to Silicon. However, this material encapsulation technology is still lagging when compared with the performance of SiC. One material that is expected to overcome this issue is epoxy molding c...
Saved in:
| Main Author: | |
|---|---|
| Format: | Theses |
| Language: | Indonesia |
| Online Access: | https://digilib.itb.ac.id/gdl/view/81719 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Institut Teknologi Bandung |
| Language: | Indonesia |