Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging
Reliability of lead-free solders, used in harsh conditions such as in automotive, is still a serious concern. Simultaneous additions of multiple alloying elements like Bismuth (Bi), Antimony (Sb), Nickel (Ni) etc. to conventional Sn-Ag-Cu (SAC) based solders have recently been investigated to improv...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Published: |
Elsevier
2022
|
| Subjects: | |
| Online Access: | http://eprints.um.edu.my/40892/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Universiti Malaya |