Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging

Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging

Reliability of lead-free solders, used in harsh conditions such as in automotive, is still a serious concern. Simultaneous additions of multiple alloying elements like Bismuth (Bi), Antimony (Sb), Nickel (Ni) etc. to conventional Sn-Ag-Cu (SAC) based solders have recently been investigated to improv...

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Main Authors: Zhou, Ding, Haseeb, A.S. Md. Abdul, Andriyana, Andri
Format: Article
Published: Elsevier 2022
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.um.edu.my/40892/
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Institution: Universiti Malaya
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spelling my.um.eprints.408922023-09-25T06:27:56Z http://eprints.um.edu.my/40892/ Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging Zhou, Ding Haseeb, A.S. Md. Abdul Andriyana, Andri TJ Mechanical engineering and machinery Reliability of lead-free solders, used in harsh conditions such as in automotive, is still a serious concern. Simultaneous additions of multiple alloying elements like Bismuth (Bi), Antimony (Sb), Nickel (Ni) etc. to conventional Sn-Ag-Cu (SAC) based solders have recently been investigated to improve their reliability. The additional elements can bring about the improvements through solid solution and precipitation strengthening. In this study, the effects of simultaneous additions of Bi, Sb and Ni to SAC 305 solder on the evolution of microstructure and mechanical properties of the solder under thermal aging at 125 degrees C for up to 1008 h are investigated. Superior microstructural stability and improved mechanical strength of the multicomponent alloy at long aging time and its fracture behavior are discussed. Elsevier 2022-12 Article PeerReviewed Zhou, Ding and Haseeb, A.S. Md. Abdul and Andriyana, Andri (2022) Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging. Materials Today Communications, 33. ISSN 2352-4928, DOI https://doi.org/10.1016/j.mtcomm.2022.104430 <https://doi.org/10.1016/j.mtcomm.2022.104430>. 10.1016/j.mtcomm.2022.104430
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Zhou, Ding
Haseeb, A.S. Md. Abdul
Andriyana, Andri
Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging
description Reliability of lead-free solders, used in harsh conditions such as in automotive, is still a serious concern. Simultaneous additions of multiple alloying elements like Bismuth (Bi), Antimony (Sb), Nickel (Ni) etc. to conventional Sn-Ag-Cu (SAC) based solders have recently been investigated to improve their reliability. The additional elements can bring about the improvements through solid solution and precipitation strengthening. In this study, the effects of simultaneous additions of Bi, Sb and Ni to SAC 305 solder on the evolution of microstructure and mechanical properties of the solder under thermal aging at 125 degrees C for up to 1008 h are investigated. Superior microstructural stability and improved mechanical strength of the multicomponent alloy at long aging time and its fracture behavior are discussed.
format Article
author Zhou, Ding
Haseeb, A.S. Md. Abdul
Andriyana, Andri
author_facet Zhou, Ding
Haseeb, A.S. Md. Abdul
Andriyana, Andri
author_sort Zhou, Ding
title Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging
title_short Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging
title_full Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging
title_fullStr Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging
title_full_unstemmed Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging
title_sort mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging
publisher Elsevier
publishDate 2022
url http://eprints.um.edu.my/40892/
_version_ 1778161624211783680

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