Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging
Reliability of lead-free solders, used in harsh conditions such as in automotive, is still a serious concern. Simultaneous additions of multiple alloying elements like Bismuth (Bi), Antimony (Sb), Nickel (Ni) etc. to conventional Sn-Ag-Cu (SAC) based solders have recently been investigated to improv...
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| Main Authors: | , , |
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| Format: | Article |
| Published: |
Elsevier
2022
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/40892/ |
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| Institution: | Universiti Malaya |
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