Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives

Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives

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Bibliographic Details
Main Authors: Lin-Ngee, Ho, Teng, Fei Wu, Nishikawa, Hiroshi, Takemoto, Tadashi, Miyake, Koichi, Fujita, Masakazu, Ota, Koyu
Other Authors: holingee@yahoo.com
Format: Article
Language:English
Published: Springer 2011
Subjects:
Electrical reliability
Copper alloy filler
Cu-Ag
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/13151
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Institution: Universiti Malaysia Perlis
Language: English

Internet

http://dspace.unimap.edu.my/xmlui/handle/123456789/13151

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