Effect of different copper fillers on the electrical resistivity of conductive adhesives

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Bibliographic Details
Main Authors: Li-Ngee, Ho, Nishikawa, Hiroshi, Takemoto, Tadashi
Other Authors: holingee@yahoo.com
Format: Article
Language:English
Published: Springer Science+Business Media, LLC 2011
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Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/14016
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Institution: Universiti Malaysia Perlis
Language: English
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Summary:Link to publisher's homepage at http://www.springerlink.com