Effect of different copper fillers on the electrical resistivity of conductive adhesives

• Main Authors: Li-Ngee, Ho, Nishikawa, Hiroshi, Takemoto, Tadashi
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Springer Science+Business Media, LLC 2011
• Subjects: Conductive adhesive; Different copper fillers; Electrical resistivity; Electrically conductive adhesives
• Online Access: http://dspace.unimap.edu.my/xmlui/handle/123456789/14016
• Institution: Universiti Malaysia Perlis

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