Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application

Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application

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Bibliographic Details
Main Author: Siti Amira Faisha Shikh Zakaria
Other Authors: Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari
Format: Learning Object
Language:English
Published: Universiti Malaysia Perlis 2012
Subjects:
SiC powder
Materials engineering
Cooper silicon carbide
Silicon carbide
Powder metallurgy
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/19839
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Institution: Universiti Malaysia Perlis
Language: English
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Summary:Access is limited to UniMAP community.

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