Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application

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Main Author:	Siti Amira Faisha Shikh Zakaria
Other Authors:	Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari
Format:	Learning Object
Language:	English
Published:	Universiti Malaysia Perlis 2012
Subjects:	SiC powder Materials engineering Cooper silicon carbide Silicon carbide Powder metallurgy
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/19839
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Institution:	Universiti Malaysia Perlis
Language:	English

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spelling	my.unimap-198392012-06-13T03:56:06Z Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application Siti Amira Faisha Shikh Zakaria Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari SiC powder Materials engineering Cooper silicon carbide Silicon carbide Powder metallurgy Access is limited to UniMAP community. The use of SiC particles as reinforcements in copper based composites is considered very attractive to meet the increasing demands for high performance heat sink materials and packages since copper is a better thermal conductivity material (Cu: 400W/mK).The physical, mechanical and thermal properties of different particle sizes and volume fraction of silicon carbide reinforce in copper metal matrix composite were investigated. Powder metallurgy (P/M) method was used to fabricate the composite. Cu powder and SiC powder were mixed together in a planetary ball mill at 200rpm for two hours. Compaction with 12 tonne, and the green compact is sintered at 950oC with 6 hours soaking time in nitrogen atmosphere. The test analysis was consists of microstructure, hardness, density, porosity, and relative thermal conductivity of the copper silicon carbide composite. Sample with 5% and 10 % SiC experienced shrinkage while the 20% SiC sample shows swelling. Densities and relative thermal conductivity markedly decrease by increasing % volume and doest not shows large significant difference of mesh size. Porosity increased with % volume increased and does not show significant different between mesh size. While Hardness increase significantly with volume but decrease for the sample with 20 % SiC caused by porosity. Decreasing of size particle shows increase of hardness for sample with 5 % and 10% SiC. 2012-06-13T03:56:06Z 2012-06-13T03:56:06Z 2008-04 Learning Object http://hdl.handle.net/123456789/19839 en Universiti Malaysia Perlis School of Materials Engineering
institution	Universiti Malaysia Perlis
building	UniMAP Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaysia Perlis
content_source	UniMAP Library Digital Repository
url_provider	http://dspace.unimap.edu.my/
language	English
topic	SiC powder Materials engineering Cooper silicon carbide Silicon carbide Powder metallurgy
spellingShingle	SiC powder Materials engineering Cooper silicon carbide Silicon carbide Powder metallurgy Siti Amira Faisha Shikh Zakaria Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
description	Access is limited to UniMAP community.
author2	Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari
author_facet	Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari Siti Amira Faisha Shikh Zakaria
format	Learning Object
author	Siti Amira Faisha Shikh Zakaria
author_sort	Siti Amira Faisha Shikh Zakaria
title	Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
title_short	Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
title_full	Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
title_fullStr	Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
title_full_unstemmed	Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
title_sort	effects of volume fraction and particle size reinforcement parameter on microstructural and thermal properties of copper silicon carbide (cusic) composite for electronic packaging application
publisher	Universiti Malaysia Perlis
publishDate	2012
url	http://dspace.unimap.edu.my/xmlui/handle/123456789/19839
_version_	1643787867972960256

Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application

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