Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method

Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method

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Bibliographic Details
Main Authors: Iziana, Yahya, Noor Asikin, Ab Ghani, Mohd Arif Anuar, Mohd Salleh, Hamidi, Abd Hamid, Zainal Arifin, Ahmad, Mayappan, Ramani
Other Authors: izianayahya@gmail.com
Format: Article
Language:English
Published: Scientific.Net 2013
Subjects:
Lead-Free Solder
Powder Metallurgy
Sn-Ag-Cu
Materials engineering
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/25577
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Institution: Universiti Malaysia Perlis
Language: English
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Summary:Link to publisher's homepage at http://www.scientific.net/

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