Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method
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my.unimap-255772013-05-30T06:42:53Z Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method Iziana, Yahya Noor Asikin, Ab Ghani Mohd Arif Anuar, Mohd Salleh Hamidi, Abd Hamid Zainal Arifin, Ahmad Mayappan, Ramani izianayahya@gmail.com Lead-Free Solder Powder Metallurgy Sn-Ag-Cu Materials engineering Link to publisher's homepage at http://www.scientific.net/ The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many researchers. In the present study, the characteristics of Sn-3.5Ag-1.0Cu lead-free solder were studied. The raw materials were tin, silver and copper powders in micron size. The solder was prepared using powder metallurgy route which includes blending, compacting and sintering. Four blending times and two compacting pressures were used to investigate for optimum condition. The melting temperature of the samples were studied using differential scanning calorimeter (DSC) and the presence of Sn Ag, Cu were confirmed using x-ray diffraction analysis (XRD). Finally the effect of variables on the hardness of the solders is reported. 2013-05-30T06:42:53Z 2013-05-30T06:42:53Z 2012-04-12 Article Advanced Materials Research, vol.501, 2012, pages160-164. 1662-8985 http://www.scientific.net/AMR.501.160 10.4028/www.scientific.net/AMR.501.160 http://hdl.handle.net/123456789/25577 en Scientific.Net |
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Lead-Free Solder Powder Metallurgy Sn-Ag-Cu Materials engineering |
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Lead-Free Solder Powder Metallurgy Sn-Ag-Cu Materials engineering Iziana, Yahya Noor Asikin, Ab Ghani Mohd Arif Anuar, Mohd Salleh Hamidi, Abd Hamid Zainal Arifin, Ahmad Mayappan, Ramani Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method |
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Link to publisher's homepage at http://www.scientific.net/ |
| author2 |
izianayahya@gmail.com |
| author_facet |
izianayahya@gmail.com Iziana, Yahya Noor Asikin, Ab Ghani Mohd Arif Anuar, Mohd Salleh Hamidi, Abd Hamid Zainal Arifin, Ahmad Mayappan, Ramani |
| format |
Article |
| author |
Iziana, Yahya Noor Asikin, Ab Ghani Mohd Arif Anuar, Mohd Salleh Hamidi, Abd Hamid Zainal Arifin, Ahmad Mayappan, Ramani |
| author_sort |
Iziana, Yahya |
| title |
Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method |
| title_short |
Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method |
| title_full |
Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method |
| title_fullStr |
Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method |
| title_full_unstemmed |
Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method |
| title_sort |
characterization of sn-3.5ag-1.0cu lead-free solder prepared via powder metallurgy method |
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Scientific.Net |
| publishDate |
2013 |
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http://dspace.unimap.edu.my/xmlui/handle/123456789/25577 |
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1643794700042240000 |