Extended reliability of gold and copper ball bonds in microelectronic packaging

Extended reliability of gold and copper ball bonds in microelectronic packaging

Link to publisher's homepage at http://www.goldbulletin.org/

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Bibliographic Details
Main Authors: Chong, Leong Gan, Classe, Francis, Bak, Lee Chan, Uda, Hashim, Prof. Dr.
Other Authors: chong-leong.gan@spansion.com
Format: Article
Language:English
Published: World Gold Council 2014
Subjects:
Copper bonding wire
Extended reliability
Gold bonding wire
Microelectronic packaging
Silver wire
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33097
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Institution: Universiti Malaysia Perlis
Language: English
Description
Summary:Link to publisher's homepage at http://www.goldbulletin.org/

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