Extended reliability of gold and copper ball bonds in microelectronic packaging

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Bibliographic Details
Main Authors:	Chong, Leong Gan, Classe, Francis, Bak, Lee Chan, Uda, Hashim, Prof. Dr.
Other Authors:	chong-leong.gan@spansion.com
Format:	Article
Language:	English
Published:	World Gold Council 2014
Subjects:	Copper bonding wire Extended reliability Gold bonding wire Microelectronic packaging Silver wire
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33097
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Institution:	Universiti Malaysia Perlis
Language:	English

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