Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives

• Main Authors: Ho, Li Ngee, Dr., Hiroshi, Nishikawa
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Springer Science+Business Media New York 2014
• Subjects: Adhesive materials; Conductive fillers; Electrical and mechanical properties; Electrical conductivity
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33186
• Institution: Universiti Malaysia Perlis

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