Flow analysis for flip chip underfilling process using characteristic based split method

Flow analysis for flip chip underfilling process using characteristic based split method

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Bibliographic Details
Main Authors:	Kulkarni, Venkatesh M., Seetharamu, Kankanhally N., Aswatha Narayana, P. A., Ishak, Abdul Azid, Dr., Ghulam, Abdul Quadir, Prof. Dr.
Other Authors:	knseetharamu@hotmail.com
Format:	Working Paper
Language:	English
Published:	IEEE Conference Publications 2014
Subjects:	Characteristic based split (CBS) Fluid flow equation Onvection-diffusion equation Volume of fluid (VoF) Flip chip devices
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33885
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Institution:	Universiti Malaysia Perlis
Language:	English

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