Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

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Bibliographic Details
Main Authors:	Yap, Boon Kar, Dr., Noor Azrina, Talik, Zaliman, Sauli, Dr., Foong, Chee Seng, Tan, Chou Yong, Dr., Retnasamy, Vithyacharan
Other Authors:	kbyap@uniten.edu.my
Format:	Article
Language:	English
Published:	Emerald Group Publishing Limited 2014
Subjects:	Contamination Decontamination Flip chip Flux cleaning Ionic contaminations Solvents Water-based solvent
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33932
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Institution:	Universiti Malaysia Perlis
Language:	English

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