Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology
Link to publisher's homepage at http://www.emeraldinsight.com/
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
Emerald Group Publishing Limited
2014
|
| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/33932 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Universiti Malaysia Perlis |
| Language: | English |
| id |
my.unimap-33932 |
|---|---|
| record_format |
dspace |
| spelling |
my.unimap-339322014-04-23T02:51:20Z Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology Yap, Boon Kar, Dr. Noor Azrina, Talik Zaliman, Sauli, Dr. Foong, Chee Seng Tan, Chou Yong, Dr. Retnasamy, Vithyacharan kbyap@uniten.edu.my zaliman@unimap.edu.my sundres@gmail.com Contamination Decontamination Flip chip Flux cleaning Ionic contaminations Solvents Water-based solvent Link to publisher's homepage at http://www.emeraldinsight.com/ Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the package long-term performance. Design/methodology/approach - Thus, the flux-cleaning process was implemented and the cleanliness effect was evaluated. Cleaning experiments using a new water-based solvent were carried out to investigate the flux-cleaning efficiency. The test packages were then evaluated via ion chromatography (IC). Findings - Ion chromatograms show that there are high levels of ionic elements detected prior to the cleaning process. After the cleaning process, the contamination levels reduced significantly. Originality/value - The value of the work here is testing of the new environmental friendly water-based MPC cleaning efficiency. The reduction of ionic contamination is thus reported. 2014-04-23T02:51:20Z 2014-04-23T02:51:20Z 2013 Article Microelectronics International, vol. 30(2), 2013, pages 99-103 1356-5362 http://www.emeraldinsight.com/journals.htm?articleid=17086474 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33932 en Emerald Group Publishing Limited |
| institution |
Universiti Malaysia Perlis |
| building |
UniMAP Library |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Malaysia Perlis |
| content_source |
UniMAP Library Digital Repository |
| url_provider |
http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
Contamination Decontamination Flip chip Flux cleaning Ionic contaminations Solvents Water-based solvent |
| spellingShingle |
Contamination Decontamination Flip chip Flux cleaning Ionic contaminations Solvents Water-based solvent Yap, Boon Kar, Dr. Noor Azrina, Talik Zaliman, Sauli, Dr. Foong, Chee Seng Tan, Chou Yong, Dr. Retnasamy, Vithyacharan Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology |
| description |
Link to publisher's homepage at http://www.emeraldinsight.com/ |
| author2 |
kbyap@uniten.edu.my |
| author_facet |
kbyap@uniten.edu.my Yap, Boon Kar, Dr. Noor Azrina, Talik Zaliman, Sauli, Dr. Foong, Chee Seng Tan, Chou Yong, Dr. Retnasamy, Vithyacharan |
| format |
Article |
| author |
Yap, Boon Kar, Dr. Noor Azrina, Talik Zaliman, Sauli, Dr. Foong, Chee Seng Tan, Chou Yong, Dr. Retnasamy, Vithyacharan |
| author_sort |
Yap, Boon Kar, Dr. |
| title |
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology |
| title_short |
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology |
| title_full |
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology |
| title_fullStr |
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology |
| title_full_unstemmed |
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology |
| title_sort |
ionic contaminations level and cleaning flip chip bga package via a new cleaning solvent technology |
| publisher |
Emerald Group Publishing Limited |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33932 |
| _version_ |
1643797350940934144 |