The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)

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Main Authors:	Mazlan, Mohamed, A. Rahim, Iqbal, M. A., Mohd Mustafa Al Bakri, Abdullah, Wan Yusra Hannanah, Wan Abdul Razak, Mohd Sukhairi, Mat Rasat
Other Authors:	mazlan547@ppinang.uitm.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Computational Fluid Dynamic (CFD) Epoxy Moulding Compound (EMC) Package chip powers Plastic Leaded Chip Carrier (PLCC)
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34276
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Institution:	Universiti Malaysia Perlis
Language:	English

id	my.unimap-34276
record_format	dspace
spelling	my.unimap-342762014-05-06T02:41:42Z The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC) Mazlan, Mohamed A. Rahim Iqbal, M. A. Mohd Mustafa Al Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Mohd Sukhairi, Mat Rasat mazlan547@ppinang.uitm.edu.my mustafa_albakri@unimap.edu.my sukhairi@umk.edu.my Computational Fluid Dynamic (CFD) Epoxy Moulding Compound (EMC) Package chip powers Plastic Leaded Chip Carrier (PLCC) Link to publisher's homepage at http://www.ttp.net/ The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel is carried out using a commercial CFD code, FLUENT™ by using Epoxy Moulding Compound (EMC) as a main material. The study was made for four and eight packages with different Reynolds Number and package chip powers. The results are presented in term of junction temperature for four and eight PLCC package under different conditions. It is observed the chip temperatures of eight PLCC packages have higher junction temperature compare to four PLCC packages due to effect of other PLCC because of space and gap between PLCC that have more number of PLCC is smaller. Hence it makes junction temperature of eight PLCC higher compare to four PLCC packages. Moreover, the junction temperature of the packages decreases with increase in Reynolds Number. 2014-05-06T02:41:42Z 2014-05-06T02:41:42Z 2013 Article Advanced Materials Research, vol. 795, 2013, pages 174-181 978-303785811-0 1022-6680 http://www.scientific.net/AMR.795.174 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34276 en Trans Tech Publications
institution	Universiti Malaysia Perlis
building	UniMAP Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaysia Perlis
content_source	UniMAP Library Digital Repository
url_provider	http://dspace.unimap.edu.my/
language	English
topic	Computational Fluid Dynamic (CFD) Epoxy Moulding Compound (EMC) Package chip powers Plastic Leaded Chip Carrier (PLCC)
spellingShingle	Computational Fluid Dynamic (CFD) Epoxy Moulding Compound (EMC) Package chip powers Plastic Leaded Chip Carrier (PLCC) Mazlan, Mohamed A. Rahim Iqbal, M. A. Mohd Mustafa Al Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Mohd Sukhairi, Mat Rasat The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)
description	Link to publisher's homepage at http://www.ttp.net/
author2	mazlan547@ppinang.uitm.edu.my
author_facet	mazlan547@ppinang.uitm.edu.my Mazlan, Mohamed A. Rahim Iqbal, M. A. Mohd Mustafa Al Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Mohd Sukhairi, Mat Rasat
format	Article
author	Mazlan, Mohamed A. Rahim Iqbal, M. A. Mohd Mustafa Al Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Mohd Sukhairi, Mat Rasat
author_sort	Mazlan, Mohamed
title	The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)
title_short	The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)
title_full	The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)
title_fullStr	The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)
title_full_unstemmed	The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)
title_sort	comparison between four plcc packages and eight plcc packages in personal computer (pc) using computational fluid dynamic (cfd), fluent software™ using epoxy moulding compound material (emc)
publisher	Trans Tech Publications
publishDate	2014
url	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34276
_version_	1643797446080331776

The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)

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