The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)

• Main Authors: Mazlan, Mohamed, A. Rahim, Iqbal, M. A., Mohd Mustafa Al Bakri, Abdullah, Wan Yusra Hannanah, Wan Abdul Razak, Mohd Sukhairi, Mat Rasat
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Trans Tech Publications 2014
• Subjects: Computational Fluid Dynamic (CFD); Epoxy Moulding Compound (EMC); Package chip powers; Plastic Leaded Chip Carrier (PLCC)
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/34276
• Institution: Universiti Malaysia Perlis

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