The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)

The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)

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Bibliographic Details
Main Authors: Mazlan, Mohamed, A. Rahim, Iqbal, M. A., Mohd Mustafa Al Bakri, Abdullah, Wan Yusra Hannanah, Wan Abdul Razak, Mohd Sukhairi, Mat Rasat
Other Authors: mazlan547@ppinang.uitm.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Computational Fluid Dynamic (CFD)
Epoxy Moulding Compound (EMC)
Package chip powers
Plastic Leaded Chip Carrier (PLCC)
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34276
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Institution: Universiti Malaysia Perlis
Language: English

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http://dspace.unimap.edu.my:80/dspace/handle/123456789/34276

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