Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component

Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component

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Bibliographic Details
Main Author: Tan, Chun Huat
Other Authors: Dr. Muhammad Iqbal Hussain
Format: Learning Object
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2014
Subjects:
Printed circuit board assembly (PCBA)
Manufacturing process
Ball grid array (BGA)
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/37912
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Institution: Universiti Malaysia Perlis
Language: English

Internet

http://dspace.unimap.edu.my:80/xmlui/handle/123456789/37912

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