Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component

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Bibliographic Details
Main Author:	Tan, Chun Huat
Other Authors:	Dr. Muhammad Iqbal Hussain
Format:	Learning Object
Language:	English
Published:	Universiti Malaysia Perlis (UniMAP) 2014
Subjects:	Printed circuit board assembly (PCBA) Manufacturing process Ball grid array (BGA)
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/37912
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Institution:	Universiti Malaysia Perlis
Language:	English

id	my.unimap-37912
record_format	dspace
spelling	my.unimap-379122014-11-28T03:13:12Z Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component Tan, Chun Huat Dr. Muhammad Iqbal Hussain Printed circuit board assembly (PCBA) Manufacturing process Ball grid array (BGA) Access is limited to UniMAP community. The manufacturing of printed circuit board assembly (PCBA) is facing many problems especially in ball grid array (BGA) assembly. Therefore, it is important to focus on manufacturing process. Process improvement in this study is conducted in the company ‘S’ on the printed circuit board assembly (PCBA) production line. The objectives of the study is to collect and analyze data of selected printed circuit board assembly (PCBA) process parameters in order to reduce the number of defects of assembly process for plastic ball grid array (PBGA) component. There are four important variables in this study which is factor A-print speed, factor B-solder paste thickness, factor C-semi auto connecter jig force, and factor D-separation speed. Using design of experiment (DOE), the experiments are designed with one-half fraction of a 24 design or 24-1 design method for screening experiments. Twenty numbers of experiments are run in production line in the factory. Finally, experiments are designed with central composite design (CCD) to optimal concentration significant factors that obtain from screening experiments. Seventeen numbers of experiments are run in production line in company ‘S’. Total thirty-seven numbers of experiments had been conducted. Software Design Expert is used for simulation and data analysis. ANOVA (analysis of variance) is performed to know interactive effect of the variables on the responses which is to reduce number of defects. It is suggested that the optimal setting of the parameters can reduce number of defects and company can save cost. 2014-11-28T03:13:11Z 2014-11-28T03:13:11Z 2009-05 Learning Object http://dspace.unimap.edu.my:80/xmlui/handle/123456789/37912 en Universiti Malaysia Perlis (UniMAP) School of Manufacturing Engineering
institution	Universiti Malaysia Perlis
building	UniMAP Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaysia Perlis
content_source	UniMAP Library Digital Repository
url_provider	http://dspace.unimap.edu.my/
language	English
topic	Printed circuit board assembly (PCBA) Manufacturing process Ball grid array (BGA)
spellingShingle	Printed circuit board assembly (PCBA) Manufacturing process Ball grid array (BGA) Tan, Chun Huat Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
description	Access is limited to UniMAP community.
author2	Dr. Muhammad Iqbal Hussain
author_facet	Dr. Muhammad Iqbal Hussain Tan, Chun Huat
format	Learning Object
author	Tan, Chun Huat
author_sort	Tan, Chun Huat
title	Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
title_short	Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
title_full	Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
title_fullStr	Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
title_full_unstemmed	Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
title_sort	application of statistical methods to reduce the defect of assembly process for plastic ball grid array (pbga) component
publisher	Universiti Malaysia Perlis (UniMAP)
publishDate	2014
url	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/37912
_version_	1643790746619215872

Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component

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