Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component

• Main Author: Tan, Chun Huat
• Other Authors: Dr. Muhammad Iqbal Hussain
• Format: Learning Object
• Language: English
• Published: Universiti Malaysia Perlis (UniMAP) 2014
• Subjects: Printed circuit board assembly (PCBA); Manufacturing process; Ball grid array (BGA)
• Online Access: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/37912
• Institution: Universiti Malaysia Perlis

Access is limited to UniMAP community.