The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint

The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint

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Bibliographic Details
Main Authors: Mohd Arif Anuar, Mohd Salleh, Mohd Izrul Izwan, Ramli, Rita, Mohd Said, Mohd Mustafa Al Bakri, Abdullah, Dewi Suriyani, Che Halin, Norainiza, Saud, Nabiałek, Marcin
Other Authors: arifanuar@unimap.edu.my
Format: Article
Language:English
Published: MDPI AG 2022
Subjects:
Zinc
Intermetallic compound
IMC thickness
Annealing process
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74758
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Institution: Universiti Malaysia Perlis
Language: English
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Summary:Link to publisher's homepage at https://www.mdpi.com/

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