The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
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my.unimap-747582022-03-23T01:38:19Z The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint Mohd Arif Anuar, Mohd Salleh Mohd Izrul Izwan, Ramli Mohd Arif Anuar, Mohd Salleh Rita, Mohd Said Mohd Mustafa Al Bakri, Abdullah Dewi Suriyani, Che Halin Norainiza, Saud Nabiałek, Marcin arifanuar@unimap.edu.my Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP) Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP) Department of Physics, Czestochowa University of Technology Zinc Intermetallic compound IMC thickness Annealing process Link to publisher's homepage at https://www.mdpi.com/ The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu3Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu6Sn5 phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint 2022 2022-03-23T01:38:19Z 2022-03-23T01:38:19Z 2021-02 Article Metals, vol.11(3), 2021, 11 pages 2075-4701 http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74758 https://doi.org/10.3390/met11030380 en MDPI AG |
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Zinc Intermetallic compound IMC thickness Annealing process |
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Zinc Intermetallic compound IMC thickness Annealing process Mohd Arif Anuar, Mohd Salleh Mohd Izrul Izwan, Ramli Mohd Arif Anuar, Mohd Salleh Rita, Mohd Said Mohd Mustafa Al Bakri, Abdullah Dewi Suriyani, Che Halin Norainiza, Saud Nabiałek, Marcin The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint |
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Link to publisher's homepage at https://www.mdpi.com/ |
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arifanuar@unimap.edu.my |
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arifanuar@unimap.edu.my Mohd Arif Anuar, Mohd Salleh Mohd Izrul Izwan, Ramli Mohd Arif Anuar, Mohd Salleh Rita, Mohd Said Mohd Mustafa Al Bakri, Abdullah Dewi Suriyani, Che Halin Norainiza, Saud Nabiałek, Marcin |
| format |
Article |
| author |
Mohd Arif Anuar, Mohd Salleh Mohd Izrul Izwan, Ramli Mohd Arif Anuar, Mohd Salleh Rita, Mohd Said Mohd Mustafa Al Bakri, Abdullah Dewi Suriyani, Che Halin Norainiza, Saud Nabiałek, Marcin |
| author_sort |
Mohd Arif Anuar, Mohd Salleh |
| title |
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint |
| title_short |
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint |
| title_full |
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint |
| title_fullStr |
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint |
| title_full_unstemmed |
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint |
| title_sort |
effect of thermal annealing on the microstructure and mechanical properties of sn-0.7cu-xzn solder joint |
| publisher |
MDPI AG |
| publishDate |
2022 |
| url |
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74758 |
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1729704802575712256 |